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K8凯发新科明毅电子FPC填孔电镀设备 ，专为AI高阶软板填孔制程打造
Date: 2026-07-20　Click: 297
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伴随智能手机向端侧AI等方向升级 ，高阶FPC技术要求持续攀升 ，生产制备工艺正沿着更高厚径比的方向快速演进。


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在这一趋势下 ，FPC的厚径比需求逐步抬升 ，传统填孔电镀工艺的孔内填充质量与量产良率遭遇显著瓶颈 ，难以满足高阶FPC生产需求。



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面对这一瓶颈 ，明毅电子自主研发的 FPC 填孔电镀设备——采用片式垂直连续电镀工艺 ，搭载高喷流技术 ，可适配高阶软板填孔制程。


K8凯发(中国)天生赢家·一触即发


相比传统工艺方案 ，该设备以更高厚径比的填孔能力、更优的面铜均匀性、更可靠的薄板走板表现与更高的生产良率 ，可满足 AI 手机等终端对高阶软板的量产需求。


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